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MIRTHE

Monolithic InP-based Dual Polarization QPSK Integrated Receiver and Transmitter for CoHerent 100-400Gb Ethernet

Project overview.

MIRTHE targets new multilevel-modulation all-monolithic integrated TX and RX Photonic Integrated Circuits (PICs) able to achieve 100-400 Gb/s aggregated speed on a single wavelength. This project is motivated by:

  • The reduction of cost and power consumption of 100Gb/s transmission equipment.
  • The need of future-proof component technologies for next generation terabit networks.

Chips will be packaged and driven at 28 and then 56 GBauds to realize first PIC-to-PIC Terabit range transmissions. The innovation introduced by the monolithic integration of RX and TX with novel vector EAM-based sources should bring a real breakthrough in cost, size and consumption of Terabit components.

 

 

The specific objectives are:

  • Demonstration and mastering of a monolithic integration technology of InP-based TX and RX chips suitable for handling 100Gb/s QPSK-type modulation formats.
  • Demonstration of a future-proof approach by enhancing the bit rate to 200 Gb/s and providing concepts up to 400 Gb/s on a single fiber and wavelength.
  • Module packaging of the TX and RX PICs with driving electronics.
  • Demonstration of PIC to PIC transmission at 100 and 200 Gb/s.
  • Simulations at the device and system levels to identify capabilities and limitations and to contribute to specifications.

The innovations claimed are:

  • Small size TX chips suitable for multi-level coding (QPSK, QAM), based on phase switching in EAM-based PICs.
  • Fully integrated RX chips demultiplexing both polarizations of the incoming light signal (DP-QPSK).
  • Evaluation and prototype fabrication of novel monolithic coherent receiver types, applying multiport approaches.
  • Demonstration of low-power low-footprint multi-level coding TX and RX.
  • Coplanar coherent receiver package with gain-controlled linear electrical amplifiers.
  • Demonstration of 200 – 400 Gb/s capability of InP-based TX and RX PICs.
  • Integrated approach for photonic circuit numerical modelling and design. 

 

 

CONSORTIUM

 

 


 


 

 

 


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Next MIRTHE Meeting in Villarceaux - 20-21 January 2014